KYOKU IHOU（Qu Weifeng）Professor

Chair Professor of Semiconductor Materials

AFFILIATION

• Tsinghua University, School of Integrated Circuits

EDUCATION
• Ph.D. in Engineering, Kanazawa University, Japan（1996）

ACADEMIC APPOINTMENTS
• Chair Professor, Tsinghua University (2023-present)
• Distinguished Visiting Professor, Tsinghua University (2022-2023)
• Member, Committee 145, Japan Society for the Promotion of Science (JSPS)

PROFESSIONAL EXPERIENCE
• Chief Researcher & Laboratory Director (25 years)
Isobe Research Institute, Shin-Etsu Semiconductor Co., Ltd., Japan
• Head, AW Research & Development Division
Shin-Etsu Semiconductor Co., Ltd., Japan

RESEARCH FOCUS
• Physics and manufacturing processes of silicon and ultra-wide band-gap semiconductor materials

KEY ACHIEVEMENTS
• Published 37 papers in top-tier journals (since 2000)
• Holds 140+ international patents with multiple world-first innovations in advanced semiconductor materials
• Recognized as second-generation leader in Japan's silicon materials field
• Achieved dominant global market shares for developed materials

MAJOR RESEARCH BREAKTHROUGHS

1. “IG-NANA” Nitrogen-Doped Silicon Annealing Wafer

• Supports process technologies down to 5nm node

• Applied in logic circuits, memory devices, automotive/power ICs

• Captures ≈30% of global silicon annealed material market

2. Carbon-Implanted Epitaxial Silicon Technology

• Solved persistent "White Spot" and dark current issues in image sensors

• Adopted by major solid-state imaging device manufacturers

3. RTA Silicon Wafers for 3D Memory

• Developed rapid thermal annealing wafers for multi-layered DRAM/NAND

• Achieved ≈50% global market share

INDUSTRY IMPACT
• Successfully commercialized 3 industry-standard semiconductor materials
• Technologies adopted by leading global semiconductor manufacturers

• Delivered 3 industry-standard semiconductor materials with >$2B cumulative revenue.

HONORS & METRICS

• Second-generation leader in Japan's silicon materials field (JPS Award, 2018).

• Shin-Etsu Innovation Prize (2006, 2017, 2022).